This announcement closely follows the launch of two other RX600 groups: the RX62N and RX621 MCUs, which feature enhanced connectivity capabilities. All of these devices feature the RX CPU that powers next-generation 32-bit MCUs and integrates the functions of Renesas Technology’s existing 16-bit and 32-bit MCU chips. Besides the fast speed, high performance, and low power consumption that characterize all RX chips, the RX62T MCUs offer the improved motor/inverter control timers and enhanced analog peripheral functions essential for implementing more precise control capabilities and providing value-added features in embedded system designs that are more power efficient.

Controlling three motors simultaneously with one MCU

For example, RX62T MCUs include MTU3 multifunction timer-pulse units, specialized for motor control, which can drive up to two 3-phase motors. The MCUs also integrate a newly developed 16-bit general-purpose PWM timer (GPT) capable of driving a 3-phase motor. With this combination of timers, one RX62T MCU can control up to three 3-phase motors simultaneously. The timers use the same clock as the MCU, which is capable of 100MHz, enabling the timers to produce a wide range of PWM output waveforms with 10 ns resolution.

The floating-point unit (FPU) and improved analog functions built into RX62T MCUs make these devices ideal for use with three-shunt or single-shunt vector-type motor control methods, while also making the chips easier to use. The single-precision FPU offloads the RX CPU and simplifies decimal-point calculations, boosting overall processing performance and simplifying firmware development. There are two 12-bit A/D converter units and one 10-bit A/D converter unit that can capture analog input values from up to 20 channels at a minimum conversion time of 1 us. Each of the A/D units can be triggered by timer units and can sample three phases in parallel.

The 12-bit A/D includes three programmable gain amplifiers and three window comparators. This eliminates external operational amplifiers and comparators used for overcurrent and overvoltage protection. Elimination of these external components reduces system cost and simplifies PCB layout.

Achieving high performance without being limited by flash technology

The MCUs in the RX62T group provide scalable memory solutions from 64KB flash to 256KB flash, and with up to 16KB RAM embedded. An additional independent 8KB of data-flash memory with a background operation (BGO) function is included, allowing data to be written at the same time a program is executing.

The embedded flash memory is based on the renowned Renesas MONOS (Metal Oxide Nitride Oxide Silicon) technology that can be accessed at 100MHz without wait-state insertion. This fast memory, combined with the RX’s Harvard-type architecture, enables the MCUs to deliver 1.65 DMIPS/MHz at any CPU frequency up to 100MHz, without any limitation from flash technology. Despite this excellent level of processing performance, all devices in the RX62T group achieve very low power consumption: only 0.5mA/MHz in full active mode with all peripherals operating. Packages for the new MCUs include 64-pin, 80-pin, 100-pin and 112-pin LQFPs.

To help customers shorten the development cycles of new embedded systems, RX62T MCUs provide a JTAG debugger interface that allows connections to the Renesas E1 and E20 on-chip debuggers and also enables access to similar JTAG third-party debugging products. Moreover, Renesas, third-party suppliers and a global network of alliance partners support RX MCUs with a large, diverse range of hardware and software development tools.

Pricing and availability

The 100MHz RX62T microcontrollers are currently sampling to lead customers. Example pricing at 10K quantity is $3.35 for the R5F562T7BDFM version—an RX62T MCU with 128KB main flash, 8KB data flash, and 8KB SRAM in an LQFP64 package.

SARCON XR-Um-Al is manufactured with a thin aluminum carrier film for customer-friendly application. The low adhesion aluminum barrier enables users to remove the carrier film after installation with no pull-out effect. This thermal interface material is available in sheets up to 50mm x 50mm with thicknesses ranging from 0.2mm to 0.5mm. SARCON XR-Um-Al complies with UL 94 V-0 flame retardancy specifications and is most commonly used to transfer heat from between CPUs and semiconductors to close proximity heat sinks.

All of these general-purpose MCUs are well suited for applications in the appliance; consumer; industrial and automotive markets, among others. A video demonstrating the PIC16LF1823 MCU’s low active current is available through editorial contact or YouTube (feel free to embed on your Web site): http://www.microchip.com/get/MSD1. nanoWatt XLP technology remains the standard for battery-friendly MCUs, which, combined with the extremely low active-current consumption of these new MCUs, improves overall energy efficiency to levels currently not readily available. Microchip’s Enhanced Mid-range 8-bit architecture provides an up to 50% increase in performance, and 14 new instructions that result in up to 40% better code execution over previous-generation 8-bit PIC16 MCUs. The PIC1XF182X MCUs include dual I2C™/SPI interfaces, multiple PWM channels with independent time bases, a Data Signal Modulator, and other peripherals that enable designers to combine many functions into a single MCU. The PIC16F19XX MCUs provide up to 28 KB of Flash program memory and numerous enhanced capabilities. The on-chip LCD drive supports up to 184 segments and provides a low-power drive mode for increased efficiency. The MCUs also include up to 5 Pulse-Width Modulation (PWM) channels with independent time bases for controlling various motor types and peripherals. “With active current of less than 50 µA per MHz, Microchip has set the new industry benchmark for low-power microcontrollers,” said Tony Massimini, chief of technology with Semico Research Corporation. “These low active currents, plus sleep currents down to 20 nA and the industry-leading number of peripherals integrated onto the PIC12F182X, PIC16F182X and PIC16F19XX MCUs, enable engineers to create battery-friendly designs that also incorporate capacitive touch sensing, LCD, communications and other functions, which will help differentiate their products in the marketplace.” Steve Drehobl, vice president of Microchip’s Security, Microcontroller and Technology Development Division, said, “Microchip further solidifies its low-power leadership with the introduction of the PIC1XF182X and PIC16F19XX 8-bit microcontrollers. The new MCUs represent a significant expansion of our enhanced Mid-range 8-bit core product family, which provides additional memory, peripherals and performance. The improvements to the active power consumption in combination with our XLP technology set the industry standard for low power operation in small 8-bit MCUs.”

With the introduction of these STM32 XL-density devices, ST now has 99 STM32 variants; the industry’s largest family of microcontrollers using the advanced ARM® Cortex™-M3 32-bit processor core, offering a range of memory densities, operating speeds, and integrated features to solve diverse application demands. All STM32 devices are pin and software compatible, and share from a common pool of peripherals. This commonality allows developers to upgrade products with minimal redesign, and to re-use their intellectual property, tools and hardware in multiple projects to reduce costs and speed-up time to market.

Additional new features of the STM32 XL-density devices include additional high-speed volatile memory (RAM), up to 96KB, which can simplify software design and speed-up execution. Six more timers are also included, increasing flexibility for applications such as motor control, factory automation or power distribution. Furthermore, a Memory Protection Unit (MPU) has been added, which is transparent to existing software but allows new applications to protect specific code or data during execution. This feature permits efficient use of existing certified software modules in projects such as medical or metering equipment, saving the time and cost to re-certify the complete application.

The 1MB Flash memory is organized in two banks of 512Kbytes.This dual-bank architecture thereby enables safe upgrading of applications in the field by uploading new software into the second memory bank. The update can then be copied across safely into the main bank, and the process managed to protect against hazards such as power loss while the upgrade is being applied.

The new devices complement the existing product lines of the industry’s most extensive Cortex-M3 microcontroller portfolio. The STM32F101Access Line XL density devices continue to provide the low-cost and high-functionality established with the original STM32 Access Line. The STM32F103Performance Line XL density devices extend the existing Performance Line that features faster 72MHz core and extra connectivity like USB and CAN, to applications that require additional memory. With these XL density devices, both lines now comprise versions with 768Kbyte or 1Mbyte Flash memory in a choice of 64-, 100-, or 144-pin packages.

The complete STM32 product portfolio includes the Access Line devices, the USB Access Line with on-chip USB support, the 72MHz Performance Line with USB and CAN, and the Connectivity Line supporting Ethernet, USB OTG and dual CAN. The new STM32 XL density devices are now sampling to lead customers. High-volume availability will begin from Q2 2010. Prices for 10Kunit range from $4.78 for the Access Line STM32F101RFT6 with 768Kbyte Flash and LQFP64 package, to $7.11 for the Performance Line STM32F103RGZ6 with 1MByte Flash and LQFP144 package.

Unlike previous solutions, which required up to three different test stands to characterize a device, material, or process thoroughly, the Model 4225-PMU’s broad dynamic range allows characterizing the full range of materials, devices, and processes with a single set of instrumentation. Now, labs can configure one flexible system to handle all three measurement types: precision DC I-V (Model 4200-SMU), AC impedance (Model 4210-CVU C-V Instrument), and ultra-fast I-V or transient I-V (Model 4225-PMU).

Two Channels of Integrated Sourcing and Measurement in a Single Module

Each 4225-PMU module provides two channels of integrated sourcing and measurement but takes up only one slot in the nine-slot chassis. Each chassis can accommodate up to four modules for a maximum of eight ultra-fast source/measure channels. Each channel combines high speed voltage outputs (with pulse widths ranging from 60 nanoseconds to DC) with simultaneous current and voltage measurements. The module provides high speed voltage pulsing with simultaneous current and voltage measurement, at acquisition rates of up to 200 megasamples/second (MS/s) with 14-bit analog-to-digital converters (A/Ds), using two A/Ds per channel (four A/Ds per card). Users can choose from two voltage source ranges (±10 volts or ± 40 volts into 1 megaohm) and four current measurement ranges (800 milliamps, 200 milliamps, 10 milliamps, 100 microamps).

Optional Hardware Expands Source-Measure Flexibility

Each Model 4225-PMU can be equipped with up to two optional Model 4225-RPM Remote Amplifier/Switches, which provide four additional low current ranges. They also reduce cable capacitance effects and support automatic switching between the Model 4225-PMU, the Model 4210-CVU, and other SMUs installed in the chassis. The Model 4220-PGU Pulse Generator Unit, which offers a voltage-sourcing-only alternative to the Model 4225-PMU, is also available.

Broad Array of Material, Device, and Process Characterization Applications

Together, the 4225-PMU and 4225-RPM provide all the tools necessary to perform a broad array of applications that no other single instrument chassis can support. Some key application areas include:
General-purpose ultra-fast I-V measurements. Pulsed I-V testing has a wide variety of uses, including preventing device self-heating by using narrow pulses and/or low duty cycle pulses rather than DC signals.
CMOS device characterization. The 4225-PMU/4225-RPM’s high speed voltage sourcing and current measurement sensitivity make them well-suited for CMOS device characterization, including high-K devices and advanced CMOS technologies like Silicon-on-Insulator (SOI).
Non-volatile memory device testing. The system’s KTEI software includes toolkits for testing both flash and phase change memory (PCM) devices. The system is well-suited for testing single memory cells or a small array, such as in R&D or process verification.
Characterizing compound semiconductor devices and materials. The Model 4225-PMU is useful for characterizing III-V materials, such as gallium nitride (GaN), gallium arsenide (GaAs), and other compound semiconductors. It allows setting a pulse offset voltage so measurements can be made from a non-zero value, for investigating the amplifier gain or linearity of a device.
NBTI/PBTI reliability tests. The optional Model 4200-BTI-A Ultra-Fast BTI Package combines all the hardware and software needed to implement all known BTI test methodologies with the fastest, most sensitive measurements available. In addition, Automatic Characterization Suite (ACS) software supports full wafer- and cassette-level automation and includes NBTI/PBTI test libraries with easy-to-use GUIs.

Four Programmable Sweep Options

The Model 4225-PMU can generate four types of sweeps: Linear Sweep, Pulsed, Arbitrary Waveform, and Segment ARB® (patent pending). The Segment ARB mode simplifies creating, storing, and generating waveforms made up of up to 2048 user-defined line segments for exceptional waveform generation flexibility.

High Performance Cabling

An optional multi-measurement performance cable kit connects the Model 4200-SCS to a prober manipulator, simplifying switching between DC I-V, C-V, and ultra-fast I-V testing configurations, eliminating the need for re-cabling, and enhancing signal fidelity.

Price and Availability

The price of the Model 4225-PMU is $19,000 USD. A typical configuration of one Model 4225-PMU and two Model 4225-RPMs costs $25,000 USD. The Model 4220-PGU (voltage source only) costs $13,000 USD. All three products will be available beginning in May 2010.

SMART’s Xceed iSATA embedded SSD is an industrial-grade 3Gbps Serial-ATA (SATA -II), embedded, SLC SSD. Targeting the needs of OEM customers in the server, storage accelerators, networking, and data communications markets requiring reliable internal storage, the reduced footprint of the Xceed iSATA (55.88 x 30.48mm x 13.75mm) is designed specifically for space-constrained embedded applications where traditional 1.8” and 2.5” HDDs and SSDs are too large.

Unlike traditional SSD’s, the Xceed iSATA requires no cables, drive mounting or other drive mounting equipment. SMART’s Xceed iSATA embedded SSD products offer leading edge read performance of up to 86MB/s (Maximum) and write performance up to 55MB/s (Maximum) and are available in various capacities, ranging from 2GB to 32GB. The Xceed iSATA provides support for lower density applications not readily available from HDD manufacturers.

Features

Whole Drive Static Wear Leveling
Advanced Error Detection/Correction circuitry for superior data reliability
Self-Monitoring Analysis and Reporting Technology (S.M.A.R.T.) support
Supports 48bit LBA addressing with larger max transfer size
Improved shock and vibration resistance over rotating media
Indicator LED to indicate drive accesses
External LED Activity Signaling (through the SATA connector) (Pin 11)
Provides Health Status Monitor
Zero seek time
Noiseless operation

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