Silicon Labs Unveils Industry’s Most Frequency Flexible CMOS Clock Generators

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Silicon Laboratories Inc. (NASDAQ: SLAB), a leader in high-performance, analog-intensive, mixed-signal ICs, today introduced the industry’s most frequency flexible in-circuit programmable CMOS clock generators. The new Si5350/51 octal clock generators with on-chip voltage-controlled crystal oscillators (VCXOs) replace traditional multi-component phase-locked loop (PLL) solutions with a single clock IC that delivers twice the frequency flexibility, 70 percent lower jitter and 30 percent lower power than competing timing products. The Si5350/51 clocks are optimized for cost-sensitive consumer electronics products such as DVRs, HDTVs, set-top boxes and gaming systems as well as printers, projectors, video conferencing, blade servers, single-board computers, RAID systems, femtocells and telecom customer premises equipment.

Click here to see downloadable versionsThe Si5350/51 clock generators leverage Silicon Labs’ patented MultiSynth technology to provide superior frequency flexibility, lower jitter, lower power and smaller footprint than any three-PLL or four-PLL clock generator on the market today. Unlike traditional clock generators that require a separate PLL to synthesize each non-integer related output frequency, the Si5350/51 devices synthesize a unique frequency on each of their eight output clocks. By integrating clock synthesis in the clock device’s output divider stage rather than its PLL, the Si5350/51 provides the equivalent clock synthesis capability of eight PLLs while dramatically reducing board space and power consumption.

The Si5350/51 generates all system clocks (audio, video, interface and SoC) and can synthesize any combination of eight unique, non-integer-related frequencies up to 133 MHz with 0 ppm frequency error. The Si5350/51 can also simultaneously generate free-running clocks from a crystal input as well as clocks synchronized to a reference clock or analog control voltage input, allowing multiple board-level timing domains to be clocked from a single device.

“Silicon Labs innovative timing technology has enabled customers to save time and cost in high-end enterprise and communications applications, eliminating supply chain headaches and providing an unparalleled level of design flexibility,” said Mike Petrowski, general manager of Silicon Labs’ timing products. “With the introduction of our Si5350/51 clocks, we are bringing our timing technology to bear on cost-sensitive consumer applications to provide reduced system cost, power and space requirements without sacrificing performance.”

The Si5350/51 clocks simplify system-level design by providing glitchless frequency shifting between two rates on up to six of the device outputs. This frequency shifting technique simplifies clock synthesis in audio and video applications, which often require a combination of frequencies to support multiple formats and display standards. It also eases processor overclocking to improve CPU performance in embedded applications and enables board-level power savings by enabling a dynamic reduction in output clock frequency.

Custom factory-programmed pin-controlled versions of the Si5350 clock generator are available using Silicon Labs’ web-based ClockBuilder™ utility. The ClockBuilder configuration utility provides turnkey, application-specific clocks, eliminating the need for field programming hardware and software. Since the Si5350/51 does not require metal mask changes to customize clock frequencies like traditional clock ICs, lead times are reduced from six weeks to less than two weeks for custom clocks. Silicon Labs also offers a field programming kit to enable rapid prototyping of both the Si5350 and Si5351 clocks.

IMEC and SUSS MicroTec to Collaborate on Wafer Bonding for 3D Integration Applications

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SUSS MicroTec, a leading supplier of process and test solutions for the semiconductor and related industries, and the Belgian nanoelectronics research center IMEC have entered a joint development program. Together, they will develop permanent bonding, temporary bonding and debonding processes for 3D system integration, including through-silicon-via (TSV) manufacturing.

IMEC will use SUSS MicroTec’s XBC300 production wafer bonder platform to develop 200 and 300mm permanent metallic interconnect bonding, as well as temporary bonding and debonding solutions for its 3D-stacked Interconnect and 3D Wafer Level Packaging technology. This universal platform can support a wide range of materials and processes, and allows debonding dies at room temperature, which is an important condition for the integration of memory ICs and CMOS image sensors. The bond cluster also includes a spin coater, a low force bonder and a plasma chamber.

For its 3D IC technology, IMEC uses a process flow where TSVs are realized in a single-damascene process that is performed immediately after front-end and contact processing but prior to processing of the back-end metallization layers. This process enables small via diameters of 1–5µm. After completion of the back-end wiring, silicon is removed from the bottom of the substrate to open the buried TSVs. Dies or wafers subsequently are stacked and interconnected in a wafer bonding step.

“We are very pleased to co-develop with SUSS MicroTec the processes for permanent and temporary wafer bonding for our 3D technologies,” said Eric Beyne, Program Director of IMEC’s Advanced Packaging and Interconnect Research Centre. “In particular, the debonding and handling of very thin wafers ranging from 25 to 50µm is an especially challenging and critical process. We are convinced that the versatility of the SUSS wafer bonding and debonding tool platform will contribute to bringing 3D integration technology to maturity.”

“Working with IMEC, a premier research facility, on 300mm 3D development for temporary and permanent bonding applications is an exciting opportunity for SUSS MicroTec,“ said Wilfried Bair, General Manager, SUSS MicroTec’s Bonder Division. “This cooperation is clearly in the path of our strategic engagement with leading industry partners at the fore-front of development. The co-development combined with our focus on understanding our customers’ needs will help us to continuously provide state-of-the-art technology and solutions to our customers today and tomorrow.”

Lil Guppie—A Modern Swiss Knife

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This swiss knife has an adjustable wrench that can be opened up to 10 mm which is good for repairing small parts. The knife is made up of high carbon steel which has a razor sharp edge. Other features of this swiss knife are listed below:

Designed and manufactured by Columbia River Knife & Tool
Compact, easy to carry tool
Steel blade, adjustable wrench, carabiner, flat screwdriver, Phillips screwdriver, pocket/money clip, bottle opener
Bead blast finish
Blade length: 1″ (2.54 cm)
Handle length: 3″ (7.6 cm)
Tool weight: 1.9 oz (54 g)