Fujipoly announces the availability of its highest performance thermal interface silicone putty. SARCON(r) XR-Um-Al is a uniquely formulated gap filler compound that has a putty-like consistency. This physical property contributes to the material’s extremely low contact and thermal resistance while maintaining a thermal conductivity of 17 watt/m-k.

SARCON XR-Um-Al is manufactured with a thin aluminum carrier film for customer-friendly application. The low adhesion aluminum barrier enables users to remove the carrier film after installation with no pull-out effect. This thermal interface material is available in sheets up to 50mm x 50mm with thicknesses ranging from 0.2mm to 0.5mm. SARCON XR-Um-Al complies with UL 94 V-0 flame retardancy specifications and is most commonly used to transfer heat from between CPUs and semiconductors to close proximity heat sinks.