[ad]

Intersil Corporation (NASDAQ Global Select: ISIL), a world leader in the design and manufacture of high-performance analog and mixed signal semiconductors, today introduced the ISL54210 and ISL54211, highly-integrated devices that extend Intersil’s leadership position in compact, high-performance mixed audio and data switches. The ISL54210 and ISL54211 combine superior low distortion performance, high-speed USB 2.0 data rates and use the industry’s most effective suppression technology to eliminate clicks and pops in handheld devices.

The new switches integrate Intersil’s MP3/USB 2.0 high-speed data interconnect and ultra low distortion audio switching technology along with advanced ‘click/pop’ elimination circuitry in a tiny micro TQFN package. The device allows audio and data paths in small handheld products such as MP3 players and smart phones to share a common mini-jack or mini-USB connector, freeing up connector pins for other functions or eliminating the need for additional connectors. Incorporating USB 2.0 high speed interconnect capability shortens digital audio file download and synchronization times, while a high off-isolation mute mode eliminates annoying clicks and pops during power up and power down. These features enable the ISL54210 and ISL54211 to deliver a low cost, compact solution for congested connectors in handheld products such as MP3 players and cell phones, as well as docking stations.

The ISL54210 is optimized for powering off an LDO regulator and includes circuitry for the detection of the USB VBUS voltage, which is used to switch between the audio and USB signal sources. The ISL54211 can operate off a Lithium Ion battery supply, and has logic control pins that are 1.8V logic compatible, allowing for direct control via a standard microcontroller.

Pricing and Availability

The ISL54210 and ISL54211 are available now in 1.8mm x 1.4mm x .50 μTQFN packages, with prices starting at $1.11 each in 1,000-piece quantities. A 10 Ld 3 x 3 TDFN version is priced at $1.07 each, and the 10 Ld 3 x 3 TDFN T+R version is priced at $1.11 each, both in 1,000-unit quantities.

For more ISLISL54210/1 information:
http://www.intersil.com/cda/deviceinfo/0,1477,ISL54210.html

[ad]

STMicroelectronics (NYSE: STM), a leading supplier of digital audio ICs, has introduced a combined audio processing and amplifier chip with enhanced features to increase performance from compact home-audio equipment. The STA339BWS is optimized for applications using small, low-cost speakers, such as flat-panel TVs and docking stations.

Digital audio techniques, such as signal processing and class-D power amplifiers, enable smaller systems to deliver high-quality room-filling sound that would be impossible with traditional hi-fi technologies. However, manufacturers are under constant pressure to deliver improved listening experiences from ever smaller and lower-cost equipment. ST’s Sound Terminal™ digital audio ICs answer these challenges using techniques such as Full Flexible Amplification (FFX) enabling a fully digital stream from sound source to loudspeaker. In the application, this produces improved audio performance, reduced cost, and smaller size.

As the latest addition to the Sound Terminal family, the STA339BWS combines IP from ST’s audio processing and class-D power amplifier ICs into a single chip, and includes advanced features such as MultiBand Dynamic Range Compression (DRC). DRC uses the latest sound-processing algorithms to enhance the performance of low-cost speakers, and also prevents large bass signals from causing vibrations and damaging small speaker units. Other important features include a seven-band equalizer. By offering two more bi-quads than common five-band equalizers, the STA339BWS improves speaker response and shaping of sound effects. A further advantage is continuous audio streaming when changing channels or audio sources, which saves muting the output to suppress noise during each transition. The output is configurable to deliver 2×20W stereo into 8-Ohm speakers or 2.1 channels at 2×10W plus 20W. This flexibility allows one hardware platform to serve several different products.

“The STA339BWS is the industry’s first single-chip device to include audio power amplification and advanced DSP processing features such as MultiBand DRC,” said Andrea Onetti, General Manager of ST’s Audio Division. “This powerful addition to the Sound Terminal family of digital audio ICs brings new functionality and higher performance, and delivers it in a smaller package, making it possible for leading home-entertainment equipment manufacturers to deliver best-in-class audio experiences for consumers.”

By combining functions that previously required a multi-chip solution into a single device, the STA339BWS simplifies product design and assembly. The new IC is also pin-compatible with existing Sound Terminal ICs for flat-panel TVs, enabling easy design-in to next-generation products. Its high level of integration, compact footprint, and high audio performance also benefit products such as docking stations and mid-power home audio equipment.

The STA339BWS is delivered in a compact PowerSSO-36 package, and is priced at $2.50 in quantities of 10,000 units.